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data sheet part no.: L-C170WDT rev: a / 4 customer?s approval : _______________ dcc : ____________ drawing no. : ds-72-06-0024 date : 2011-05-25 page 1 of 15 para-for-065
surface mount device led part no. : L-C170WDT rev: a / 4 z features ? wide view angle, white color smd chip led . ? compatible with automatic pick & place equipment. ? compatible with reflow solderi ng and wave soldering processes. ? eia std package.(ansi/eia-481-b-2001) ? i.c. compatible, low current application ? pb free product and acceptab le lead-free process!. ? meet rohs green product. ?? application ? lcd back light ? switch back lights ? illuminations. z package outline dimensions p.c board polarity 1.25 top view r0.10 led dice molding body (lens) side view 0.45 back view 1.05 - 0.35 ref. 0.95 0.80 0.28 ~ 0.30 5.00?? cathode 0.45 soldering terminal 2.00 1.50 + notes: 1. all dimensions are in millimeters. 2. tolerance is ? 0.1mm (.004") unless otherwise noted. drawing no. : ds-72-06-0024 date : 2011-05-25 page 2 of 15 para-for-068
surface mount device led part no. : L-C170WDT rev: a / 4 z chip materials ? dice material : ingan ? light color : white ? lens color : light yellow diffused. z absolute maximum ratings(ta=25 ?? ) symbol parameter rating unit p d power dissipation 100 mw i pf peak forward current (1/10 duty cycle, 0.1ms pulse width) 80 ma i f continuous forward current 20 ma - de-rating linear from 25 j 0.25 ma/ j v r reverse voltage 5 v esd electrostatic discharge threshold(hbm) note a 150 v topr operating temperature range -20 + 85 j tstg storage temperature range -40 ~ + 85 j note a : hbm : human body model. seller gives no othe r assurances regarding the ability of to withstand esd. z electro-optical characteristics (ta=25 ?? ) parameter symbol min. typ. max. unit test condition luminous intensity iv 160 350 mcd if=20ma viewing angle 2 | 1/2 130 deg note 2 cie chromaticity x 0.30 cie chromaticity y 0.30 if=20ma forward voltage vf 3.2 3.50 v if = 20ma reverse current ir 50 | a vr = 5v drawing no. : ds-72-06-0024 date : 2011-05-25 page 3 of 15 para-for-068
surface mount device led part no. : L-C170WDT rev: a / 4 z bin code list luminous intensity(iv), unit:mcd@20m a forward voltage(vf), unit:v@20ma bin code min max bin code min max s 180.0 280.0 k8 2.80 2.95 t 280.0 450.0 k9 2.95 3.10 k10 3.10 3.25 k11 3.25 3.40 tolerance of each bin are ? 15% tolerance of each bin are ? 0.1volt color rank (cie chromaticity x , y) @ 20ma rank w1 rank w2 x 0.280 0.264 0.283 0.296 x 0.287 0.283 0.330 0.330 y 0.248 0.267 0.305 0.276 y 0.295 0.305 0.360 0.339 rank w3 rank w4 x 0.296 0.287 0.330 0.330 x 0.330 0.330 0.361 0.356 y 0.276 0.295 0.339 0.318 y 0.318 0.360 0.385 0.351 ? measurement of color coordinates : +/- 0.02 c.i.e. chromaticity diagram 0.2 0.3 0.4 0.2 0.3 0.4 x y drawing no. : ds-72-06-0024 date : 2011-05-25 page 4 of 15 para-for-068 w1 w2 w3 w4
surface mount device led part no. : L-C170WDT rev: a / 4 notes: 1. luminous intensity is measured with a lig ht sensor and filter combination that proximities the cie eye-response curve. 2. | 1/2 is the off-axis angle at which the lu minous intensity is half the axial luminous intensity. 3. caution in esd : static electricity and surge damages the led. it is recommended use a wrist band or anti-electrostatic glove when handling the led. all devices, equipment and machinery must be properly grounded. 4. major standard testing equipment by ?ins trument system? model : cas140b compact array spectrometer and ?keith ley? source meter model : 2400. z typical electro-optical characteristics curves fig.1 relative intensity vs. wavelength drawing no. : ds-72-06-0024 date : 2011-05-25 page 5 of 15 para-for-068
surface mount device led part no. : L-C170WDT rev: a / 4 z typical electro-optical characteristics curve s (25 j ambient temperature unless otherwise noted) drawing no. : ds-72-06-0024 date : 2011-05-25 page 6 of 15 para-for-068 relative luminous intensity(%) ambient temperature ta( ?? ) 20 - 4 0 -60 1 -20 -0 4 060 100 80 ambient temperature ta( ?? ) 0 0 20 40 80 60 100 10 100 1000 forward current if(ma) 25 10 20 30 40 50 relative luminous lntensity normalized of 20ma 0.7 0.1 0.5 0.3 0.4 0.2 0.6 90 80 1.0 0.8 0.9 70 60 50 40 30 0 10 20 0.7 0.1 0.5 0.3 0.4 0.2 0.6 90 80 1.0 0.8 0.9 70 60 50 40 30 0 10 20 fig.1 forward current vs.forward voltage fig. 2 relative luminous intensity vs.forward current fig.3 luminous intensity vs.ambient temperature fig.4 forward current derating curve fig.5 relative intensity vs.angle fig.6 relative intensity vs.angle
surface mount device led part no. : L-C170WDT rev: a / 4 z label explanation cus. part no: to be denominated. customer: to be denominated. part no: refer to p15 iv --- luminous intensity code vf --- forward voltage code cie --- color rank code lot no: e l s 6 8 0001 a---e: for series number b---l: local f: foreign c---s:smd d---year e---month f---spec. packing quantity of bag : 3000pcs for 150 ? 170 ? 110 ? 155 ? 115 series 4000pcs for 191 series 5000pcs for 192 series date code o 2006 06 08 g h i g--- ye ar h--- month i --- day drawing no. : ds-72-06-0024 date : 2011-05-25 page 7 of 15 para-for-068 a b c d e f
surface mount device led part no. : L-C170WDT rev: a / 4 z reel dimensions notes: 1. taping quantity : 3000pcs , (minimum packing quantity will be 500 pcs for remainders) 2. the tolerances unless mentioned is ? 0.1mm, angle ? 0.5 ?? , unit : mm. drawing no. : ds-72-06-0024 date : 2011-05-25 page 8 of 15 para-for-068
surface mount device led part no. : L-C170WDT rev: a / 4 z package dimensions of tape and reel polarity progressive direction notes:all dimensions are in millimeters. moisture resistant packaging label aluminum moistue-proof bag desiccant label h:\smd\smd\smd \ ? ? .jpg h:\smd\smd\smd \ ? ? .jpg h : \ s m d \ s m d \ s m d \ ? ? . j p g h : \ s m d \ s m d \ s m d \ ? ? . j p g 2 5 5 435 145 2 4 0 2 1 0 label box carton reel notes : one reel in a bag, one bag in a inner box, ten inner boxes in a carton. unit : mm. drawing no. : ds-72-06-0024 date : 2011-05-25 page 9 of 15 para-for-068
surface mount device led part no. : L-C170WDT rev: a / 4 z cleaning ? if cleaning is required , use the following solutions for less than 1 minute and less than 40 ?? . ? appropriate chemicals: ethyl al cohol and isopro pyl alcohol. ? effect of ultrasonic cleaning on the led resi n body differs depending on such factors as the oscillator output, size of pcb and led mounting method. the use of ultrasonic cleaning should be enforced at proper out put after confirming there is no problem. z suggest soldering pad dimensions direction of pwb camber and go to reflow furnace notes : suggest stencil pr int screen thickness are 0.10mm maximum. drawing no. : ds-72-06-0024 date : 2011-05-25 page 10 of 15 para-for-068
surface mount device led part no. : L-C170WDT rev: a / 4 ?? suggest sn/pb ir reflow soldering profile condition: ?? suggest pb-free ir reflow soldering profile condition: drawing no. : ds-72-06-0024 date : 2011-05-25 page 11 of 15 para-for-068
surface mount device led part no. : L-C170WDT rev: a / 4 z cautions 1.application limitation : the led ? s described here are intended to be used for ordinary electronic equipment(such as office equipment, communication equipment and house hold application).consult para?s sales in advance for information on application in which exceptional quality and reliability are required, particularly when the failure or malfunction of the led?s may directly jeopard ize life or health (such as airplanes, automobiles, traffic control equi pment, life support system and safety devices). 2.storage : before opening the package : the leds should be store kept at 5c to 30c or less and 85%rh or less. after opening the package : the leds should be kept at 5c to 30c or less and 70%rh or less. the leds should be soldered within 168 hours(7 days) after opening the package. please avoid rapid transitions in ambient temperature in high humidity environments where condensation may occur. leds stored out of their original packaging for more than a week should be baked at 30c for at 24 hours before solder assembly. 3.soldering do not apply any stress to the lead frame during soldering while the led is at high temperature. recommended soldering condition. reflow soldering : pre-heat 120~150c, 120sec. max., peak temper ature : 240c max. solder ing time : 10 sec max. soldering iron : (not recommended) temperature 300c max., soldering time : 3 sec. max.(one time only), power dissipation of iron : 20w max. use sn60 solder of solder with silver content and don?t to touch led lens when soldering. wave soldering : pre-heat 100c max, pre-heat tim e 60 sec. max, solder wave 260c max, soldering time 5 sec. max. performed consecutively cooling process is required between 1 st and 2 nd soldering processes. drawing no. : ds-72-06-0024 date : 2011-05-25 page 12 of 15 para-for-068
surface mount device led part no. : L-C170WDT rev: a / 4 4. lead-free soldering for reflow soldering : 1 ?b pre-heat temp: 150-180 j ,120sec.max. 2 ?b soldering temp: temperature of soldering pot over 230 j ,40sec.max. 3 ?b peak temperature: 260 j?a 5sec. 4 ?b reflow repetition: 2 times max. 5 ?b suggest solder paste formul a : 93.3 sn/3.1 ag/3.1 bi/0.5 cu for soldering iron (not recommended) : 1 ?b iron tip temp: 350 j max. 2 ?b soldering iron: 30w max. 3 ?b soldering time: 3 sec. max. one time. for dip soldering : 1 ?b pre-heat temp: 150 j max. 120 sec. max. 2 ?b bath temp: 265 j max. 3 ?b dip time: 5 sec. max. 5. drive method circuit model a circuit model b (a)recommended circuit. (b)the difference of brightness be tween led`s could be found due to the vf-if characteristics of led. drawing no. : ds-72-06-0024 date : 2011-05-25 page 13 of 15 para-for-068
surface mount device led part no. : L-C170WDT rev: a / 4 6.reliability test classification test item test condition reference standard operation life ta= under room temperature as per data sheet maximum rating * test time= 1000hrs (-24hrs,+72hrs)*@20ma. mil-std-750d:1026 (1995) mil-std-883d:1005 (1991) jis c 7021:b-1 (1982) high temperature high humidity storage ir-reflow in-board, 2 times ta= 655 ?? ,rh= 90 ?? 95% *test time= 1000hrs2hrs mil-std-202f:103b(1980) jis c 7021:b-11(1982) high temperature storage ta= 1055 ?? test time= 1000hrs (-24hrs,72hrs) mil-std-883d:1008 (1991) jis c 7021:b-10 (1982) endurance test low temperature storage ta= -555 ?? * test time=1000hrs (-24hrs,72h rs) jis c 7021:b-12 (1982) temperature cycling 1055 ?? -555 ?? 10mins 10mins 100 cycles mil-std-202f:107d (1980) mil-std-750d:1051(1995) mil-std-883d:1010 (1991) jis c 7021:a-4(1982) thermal shock ir-reflow in-board, 2 times 1055 ?? -55 ?? 5 ?? 10mins 10mins 100 cycles mil-std-202f:107d(1980) mil-std-750d:1051(1995) mil-std-883d:1011 (1991) solder resistance tsol= 260 5 ?? dwell time= 10 1sec mil-std-202f:210a(1980) mil-std-750d:2031(1995) jis c 7021:a-1(1982) environmental test solder ability tsol= 235 5 j immersion time 20.5 sec immersion rate 252.5 mm/sec coverage ? 95% of the dipped surface mil-std-202f:208d(1980) mil-std-750d:2026(1995) mil-std-883d:2003(1991) iec 68 part 2-20 jis c 7021:a-2(1982) 7.others: the appearance and specifications of the product may be modified for improvement without notice. drawing no. : ds-72-06-0024 date : 2011-05-25 page 14 of 15 para-for-068
surface mount device led part no. : L-C170WDT rev: a / 4 z part no. system : l ? c 1 7 0 x c x x - x x x x drawing no. : ds-72-06-0024 date : 2011-05-25 page 15 of 15 para-for-068 xxxx : special specification for customer t : taping for 7 inch reel tc : taping for 13 inch reel th : iv half binning tp : wavelength binning lens color c : water clear w : white diffused t : color transparent d : color diffused kg : alingap 570nm super green ky : alingap 590nm super yellow kf : alingap 605nm super amber kr : alingap 630 nm super red lb : ingan 470nm blue lg : ingan 525nm green w : ingan + yag white 0 : single chip 1/2 : super thin single chip 5/6 : dual chip f : three chip(full color) 150 : 1206 1.1t type 170 : 0805 0.8t type 191 : 0603 0.6t type 192 : 0603 0.4t type 110 : 1206 1.0t type c : top view type s : side view type

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